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DEVCON
DEVCON
14278
DEVCON DEVCON
描述
DEVCON 14278
Potting and Encapsulating; Structural Adhesive; Electronic Component; 50 Ml; Electronic Component; Gray
制造商部件号
14278
BDI部件号
17116643
详情
2099-12-31
http://schema.org/NewCondition
https://schema.org/LimitedAvailability
https://www.bdiexpress.com/cn/zh/Categories/%E5%8C%96%E5%AD%A6%E5%93%81/%E5%AF%86%E5%B0%81%E5%89%82/%E7%81%8C%E5%B0%81%E5%92%8C%E5%B0%81%E8%A3%85/14278/p/17116643
单价(不含税)
请求报价
BDIExpress
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产品详细信息
分类
最低订购量
无
EAN条码
0078143142789
重量 / Kilogram
0.114
Product Group - BDI
C00104
产品名称
Potting and Encapsulating
产品类型
Structural Adhesive
典型用途
Electronic Component
容器类型
Dual Cartridge
形态
Multiple Refer to Manufacturer
应用
Electronic Component
品名
EPOXY PLUS
制造商描述
Devcon Epoxy Plus 25
颜色
Gray
容器规格（数值及单位）
50 Ml
基材
Metal | Plastic | Glass | Wood | Concrete | FRP Composite
闪点（数值及单位）
Multiple Refer to Manufacturer
气味
Multiple Refer to Manufacturer
VOC含量 - 百分比
Multiple Refer to Manufacturer
其它特点
Two Part Epoxy Technology | Rubber Toughened
净重
1.69 Oz
类别 - BDI
Chemicals Sealants Potting and Encapsulating
名称
Potting/Encapsulating
关键字串
Structural Adhesive
制造商货号
14278
重量/磅
0.25
详细描述
Potting and Encapsulating; Structural Adhesive; Electronic Component; 50 Ml; Electronic Component; Gray
